Applications:
- Bake - Long term thermal bake applications where wafers are left in ovens for multiple days.
- Thin Wafer Handling - Thin wafer handling where sharp thin wafers cut into plastic cassettes.
- Thick Wafers - Bonded or thick wafer applications where industry standard plastic cassettes will not work due to slot dimensions.
- Ultrasonic and megasonic - cleaning applications where open side wall stainless steel cassettes perform better than soundwave dampening plastic cassettes.
High temperature stainless steel for 76 mm (3”) diameter wafers. SEMI compliant 25-slot, 4.76 mm (0.1875”) pitch, 14.5 mm (0.570”) D1, 8° slot angle in the profile of an industry plastic cassette. Electro polished (EP) type 316 stainless steel. For thermal automation processing, general bake applications up to 550°C; or mega- and ultra- sonic cleaning applications.
