Applications:
- Process Equipment -Thermal processes environments where the wafer is processed in the cassette above 43° C (110° F), the typical structural threshold upper limit of plastic process cassettes. This includes chemical vapor deposition (CVD), rapid thermal processing (RTP) and wafer annealing applications.
- High wafer insertion temperatures - Process equipment where wafer insertion temperatures (wafers coming out from the process tool) exceed the melting point of a plastic cassette. The need for higher throughput reduces the amount of time the wafers are left inside the chamber to cool and acclimate.
- Precision carrier requirements - Moderate-thermal automation environments where there is a need for dimensional precision that a plastic cassette cannot offer.
- Thick Wafers - Bonded or thick wafer applications where industry standard plastic cassettes will not work due to slot dimensions.
The M2 series is an all aluminum 25-slot metal cassette with solid end wall for processing semiconductor wafers in a thermal environment, up to 250°C. A SEMI compliant cassette with straight side walls, stainless steel spacers, PTFE wafer stops, and 8° slot angles. All aluminum surfaces are (HC) hard clear anodized for prolonged abrasion resistance. ISO 3, FS209E Class 1.
