SEMICON Taiwan 2025

SEMICON Taiwan 2025 will highlight the industry’s most critical topics, including AI chips, advanced packaging, 3DIC, chiplets, FOPLP, heterogeneous integration, silicon photonics, quantum computing, and HBM. The exhibition will also cover vital issues such as supply chain resilience, green manufacturing, geopolitical challenges, and talent development, showcasing Taiwan’s strategic role and leadership in the global semiconductor value chain.