Applications:

• Process Equipment - Thermal processes environments where the wafer is processed in the cassette above 43° C (110° F), the typical structural threshold upper limit of plastic process cassettes.  This includes chemical vapor deposition (CVD), rapid thermal processing (RTP) and wafer annealing applications.
• Bake - Long term thermal bake applications where wafers are left in ovens for multiple days.
• High wafer insertion temperatures - Process equipment where wafer insertion temperatures (wafers coming out from the process tool) exceed the melting point of a plastic cassette.  The need for higher throughput reduces the amount of time the wafers are left inside the chamber to cool and acclimate. 
• Internal environment cassette - Cluster tool automation environments where a cassette is idle inside a heated vacuum environment (chamber) for multiple process steps.
• Precision carrier requirements - Moderate-thermal automation environments where there is a need for dimensional precision that a plastic cassette cannot offer.
• Thin Wafer Handling - Thin wafer handling where sharp thin wafers cut into plastic cassettes.
• Thick Wafers - Bonded or thick wafer applications where industry standard plastic cassettes will not work due to slot dimensions.

The M1 series is an all aluminum 76 mm (3") 25-slot metal cassette for processing semiconductor wafers in a thermal environment, up to 350° C. A SEMI compliant cassette with outside dimensions and 8° angular slots similar to an industry standard plastic cassette for easy integration into stage and transfer automation considerations. All aluminum surfaces are (HC) hard clear anodized for prolonged abrasion resistance.