Wafer Picks

Unlocking Precision and Efficiency in Semiconductor Manufacturing

Specialty wafer handling

At Wafer Handling Systems (WHS), we're at the forefront of shaping the future of semiconductor manufacturing with our cutting-edge WHS-G portfolio. Crafted with precision and designed for specialized applications, WHS-G mechanical wafer picks are your ultimate solution for special wafer handling requirements, offering an alternative to vacuum wands and tweezers.

Precision and versatility in wafer handling
Whether you deal with double-sided wafers, MEMS, Taiko, TSV, bonding stacks, or seek cost-effective wafer handling options, we’ve got you covered. Our picks are compatible with silicon, compound, and thin wafer handling needs, ranging in sizes from 50 mm to 300 mm round substrates.

What sets them apart is theiruse of non-abrasive cleanroom materials and their normally closed handling, preventing scratches; the trigger can be finely adjusted- with a tool to ensure delicate and consistent wafer handling, promoting uniformity among operators WHS-G1 & WHS-G2: Precision in every pick.

Our portfolio of our wafer picks models:

Landingspage-wafer-picks
P1001995

WHS-G1
Mechanical wafer pick edge grip

Our WHS-G1 and WHS-G2 series excel in cassette-to-cassette handling, sorting, and cassette to platen/flat surface handling. These antistatic normally closed edge grip mechanical wafer handling tools are designed for wafers with a thickness range of 120-1000 μm.

Our normally closed (consistent force) edge exclusion mechanical pick handles 50 mm up to 200 mm round substrates from the wafer edge. Constructed with ESD-safe PEEK material for longevity, antistatic properties, and chemical resistance, it features a perfluoro elastomer strip for a secure grip on wafers without the risk of scratching or out-gassing marking. Achieving ISO Class 4 cleanliness standards, WHS-G1 ensures precision and reliability in wafer handling.
 

  • Normally Closed Edge Wafer Handling
  • Ergonomic Safe Wafer Handling
  • ISO 4

WHS-G2
Mechanical wafer pick edge grip with spatula

Our WHS-G2 series excel in cassette-to-cassette handling, sorting, and cassette to platen/flat surface handling. These antistatic normally closed edge grip mechanical wafer handling tools are designed for wafers with a thickness range of 120-1000 μm.

Our normally closed (consistent force) edge exclusion mechanical pick handles 50 mm up to 200 mm round substrates from the wafer edge. Constructed with ESD-safe PEEK material for longevity, antistatic properties, and chemical resistance, it features a perfluoro elastomer strip for a secure grip on wafers without the risk of scratching or out-gassing marking. Achieving ISO Class 4 cleanliness standards, WHS-G2 ensures precision and reliability in wafer handling. The WHS-G2 is the knife-edge version and is designed for loading and unloading wafers from hotplates, platens, or vacuum chucks.
 

  • Normally Closed Edge Wafer Handling
  • Ergonomic Safe Wafer Handling
  • Flat Surface Interface
P1002136
312-whs-g3-3-point-mechanical-wafer-gripper-whs

WHS-G3
A new level of precision

WHS-G3 is a 3-point mechanical pick designed for processing a single wafer in a chemical bath, the chemically impervious Teflon® PTFE grippers allowing operators to place the wafer in a dish or beaker for various R&D chemistry applications. The WHS-G3 only touches the wafer on the tangential edge, never contacting the front or back of the substrate. The grippers lift the wafer from the flat surface allowing chemistry to touch the backside of the substrate.

With its unique offset low-profile handle, the WHS-G3 also functions well for wafer rescue in environments like CMP, wafer polishing, and other wafer handling where a wafer must be removed safely from an automation tool without damaging it.

  • Compound and thin wafer compatible
  • <3 mm edge contact
  • Ergonomic left/right hand use

WHS-G4
Mechanical wafer pick for TaikoTM-thinned wafers

Our WHS-G4 series for handling Taiko™ thinned wafers 200 mm (8") or 300 mm (12")

A normally closed (consistent-force) small profile edge exclusion mechanical pick for manual handling of Taiko™-thinned wafers. The WHS-G4 tool is stainless steel and anodized aluminum with antistatic Polyoxymethylene performance plastics, engineered with ESD-safe Polyimide wafer contact pads for inert, clean wafer contact. This ISO 4 compatible tool is designed for cleanroom environment longevity, antistatic properties, and general chemical resistance. This special WHS-G4 product is available in 200 mm and 300 mm wafer sizes.
 

  • Advanced anti-abrasion polymer materials
  • Static-dissipative construction
  • Ergonomically designed normally closed comfort
Wafer pick thinned wafers 200 mm (8")

Experience precision and efficiency with WHS-G

At Wafer Handling Systems, precision and innovation are at the heart of what we do. Trust us to provide you with the tools that revolutionize your semiconductor manufacturing processes, offering unparalleled precision, efficiency, and care for every wafer. Explore our WHS-G portfolio and unlock a new era in specialty wafer handling. Your journey to precision starts here.